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Technical Specifications
Parameters and characteristics for this part
| Specification | ESQT-105-03-G-D-368 |
|---|---|
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.51 µm |
| Contact Finish Thickness - Mating | 20 µin |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Post | 0.09 " |
| Contact Length - Post | 2.29 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 9.35 mm |
| Insulation Height | 0.368 in |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 10 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
...
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Type | Termination | Number of Positions | Material Flammability Rating | Insulation Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Row Spacing - Mating | Row Spacing - Mating | Insulation Color | Style | Contact Finish - Mating | Insulation Height | Insulation Height | Mounting Type | Number of Positions Loaded | Contact Shape | Contact Material | Connector Type | Fastening Type | Number of Rows | Contact Finish - Post | Current Rating (Amps) | Pitch - Mating [x] | Pitch - Mating [x] | Contact Length - Post | Contact Length - Post | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | -55 °C | 125 °C | 3 µin | 0.076 µm | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.51 µm | 20 µin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 9.35 mm | 0.368 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Gold | 4.5 A | 0.079 in | 2 mm | 0.09 " | 2.29 mm | ||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.25 çm | 10 çin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 8.25 mm | 0.325 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Tin | 4.5 A | 0.079 in | 2 mm | 0.133 in | 3.38 mm | ||||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.51 µm | 20 µin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 13.6 mm | 0.535 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Tin | 4.5 A | 0.079 in | 2 mm | 0.315 in | 8 mm | ||||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.25 çm | 10 çin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 14.53 mm | 0.572 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Tin | 4.5 A | 0.079 in | 2 mm | 0.278 " | 7.06 mm | ||||
Samtec Inc. | -55 °C | 125 °C | 3 µin | 0.076 µm | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.51 µm | 20 µin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Gold | 4.5 A | 0.079 in | 2 mm | 0.435 in | 11.05 mm | ||||
Samtec Inc. | -55 °C | 125 °C | 3 µin | 0.076 µm | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.51 µm | 20 µin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 15.6 mm | 0.614 " | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Gold | 4.5 A | 0.079 in | 2 mm | 0.236 " | 6 mm | ||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.076 µm | 3 µin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 9.4 mm | 0.37 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Tin | 4.5 A | 0.079 in | 2 mm | 0.088 in | 2.23 mm | ||||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.076 µm | 3 µin | Black | Board to Board Cable | Gold | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 1 | Tin | 4.5 A | 0.079 in | 2 mm | 0.33 in | 8.38 mm | |||||||||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.25 çm | 10 çin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 9 mm | 0.354 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Tin | 4.5 A | 0.079 in | 2 mm | 0.496 in | 12.6 mm | ||||
Samtec Inc. | -55 °C | 125 °C | Forked | Solder | 10 | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.25 çm | 10 çin | 0.079 in | 2 mm | Black | Board to Board Cable | Gold | 10.95 mm | 0.431 in | Through Hole | All | Square | Phosphor Bronze | Elevated Socket | Push-Pull | 2 | Tin | 4.5 A | 0.079 in | 2 mm | 0.419 in | 10.64 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 8.22 | |
| 10 | $ 6.30 | |||
| 100 | $ 4.89 | |||
| 500 | $ 4.15 | |||
| 1000 | $ 3.88 | |||
Description
General part information
ESQT-105 Series
10 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Documents
Technical documentation and resources