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Littelfuse Power Semi TO-247 3 H 2Sq 1W2N 3L image
Discrete Semiconductor Products

IXTH260N055T2

Active
Littelfuse/Commercial Vehicle Products

DISCMSFT NCHTRENCHGATE-GEN2 TO-247AD/ TUBE

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Littelfuse Power Semi TO-247 3 H 2Sq 1W2N 3L image
Discrete Semiconductor Products

IXTH260N055T2

Active
Littelfuse/Commercial Vehicle Products

DISCMSFT NCHTRENCHGATE-GEN2 TO-247AD/ TUBE

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationIXTH260N055T2
Current - Continuous Drain (Id) @ 25°C260 A
Drain to Source Voltage (Vdss)55 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]140 nC
Input Capacitance (Ciss) (Max) @ Vds10800 pF
Mounting TypeThrough Hole
Operating Temperature [Max]175 ░C
Operating Temperature [Min]-55 °C
Package / CaseTO-247-3
Power Dissipation (Max)480 W
Rds On (Max) @ Id, Vgs3.3 mOhm
Supplier Device PackageTO-247 (IXTH)
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.78
30$ 6.21
120$ 5.56
510$ 4.91
1020$ 4.42
2010$ 4.14
NewarkEach 250$ 4.57
500$ 4.25

Description

General part information

IXTH260N055T2 Series

These devices are offered with drain-to-source voltage ratings from 40V to 170V and provide high current capabilities of up to 600 Amperes (Tc=@25oC). The combined high current ratings of these devices and available compact package options provide designers the ability to control more power within a smaller footprint. Furthermore, these devices promote device consolidation through the reduction or elimination of multiple paralleled lower current rated MOSFET devices in high power switching applications. The resultant effect is a reduction in part count, as well as the number of required drive components, thus improving upon over-all system simplicity, reliability, and cost. Advantages: Eliminates multiple paralleled lower current rated MOSFET devices Provides the ability to control more power within a smaller footprint Improves overall system reliability and cost

Documents

Technical documentation and resources