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| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
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| Part | Delay Time - Propagation | Circuit | Package Name | Logic Type | Current - Output Low | Current - Output High | Output Type | Mounting Type | Independent Circuits | Package Length | Package Width | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Operating Temperature (Max) | Operating Temperature (Min) | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | ||||||||||||||||
 NXP USA Inc. | 3.4 ns | 8:8 | 20-TSSOP | D-Type Transparent Latch | 24 mA | 24 mA | Tri-State | Surface Mount | 1 | 0.173 in | 4.4 mm | 3.6 V | 1.65 V | 125 °C | -40 °C | |
 NXP USA Inc. | ||||||||||||||||
 NXP USA Inc. | 1.5 ns | 8:8 | 20-DHXQFN | D-Type Transparent Latch | 24 mA | 24 mA | Tri-State | Surface Mount | 1 | 4.5 mm | 2.5 mm | 3.6 V | 1.2 V | 125 °C | -40 °C | 20-XFQFN Exposed Pad |
NXP USA Inc. | ||||||||||||||||
 NXP USA Inc. |