Integrated Circuits (ICs)

UJA1075ATW/3V3/WDJ

Obsolete

HIGH-SPEED CAN/ LIN CORE SYSTEM BASIS CHIP/ REEL ROHS COMPLIANT: YES

Search across all available documentation for this part.

Integrated Circuits (ICs)

Obsolete

HIGH-SPEED CAN/ LIN CORE SYSTEM BASIS CHIP/ REEL ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Part	Package Width	Package Name	Package Features	Package Length	Mounting Type	Interface	Grade	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)
NXP USA Inc. UJA1075ATW/3V3/WDJ	6.1 mm	32-HTSSOP 32-TSSOP	Exposed Pad	0.24 in	Surface Mount	CAN LIN	Automotive	28 V	4.5 V

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	N/A	0	$ 0.00	1m+
Mouser	N/A	2000	$ 2.57	1m+
Newark	Each (Supplied on Full Reel)	500	$ 2.59	1m+

3D models and CAD resources for this part

General part information

HIGH-SPEED CAN/ LIN CORE SYSTEM BASIS CHIP/ REEL ROHS COMPLIANT: YES

Technical documentation and resources