Specification	DEPO09S565TLF

Backset Spacing	10.3 mm
Backset Spacing	0.406 in
Connector Style	D-Sub
Connector Type	Receptacle, Female Sockets
Contact Finish	Gold, GXT™, Gold
Contact Material	Copper Alloy
Contact Type	Signal
Current Rating (Amps)	7.5 A
Dielectric Material	Thermoplastic
Flange Feature	Housing/Shell
Flange Feature	4-40
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	9
Number of Rows [custom]	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Shell Size, Connector Layout [custom]	1
Shell Size, Connector Layout [custom]	DE, E
Termination	Solder
Voltage Rating	1000 VDC

DEPO09 Series

Part	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material	Voltage Rating	Dielectric Material	Contact Type	Material Flammability Rating	Current Rating (Amps)	Termination	Connector Type	Connector Style	Number of Rows [custom]	Shell Size, Connector Layout [custom]	Shell Size, Connector Layout [custom]	Mounting Type	Backset Spacing	Backset Spacing	Contact Finish	Number of Positions	Flange Feature	Flange Feature	Features	Contact Finish Thickness	Contact Finish Thickness
Amphenol ICC (FCI) DEPO09S565TLF	-55 C	125 °C	Copper Alloy	1000 VDC	Thermoplastic	Signal	UL94 V-0	7.5 A	Solder	Receptacle Female Sockets	D-Sub	2	1	DE E	Right Angle Through Hole	10.3 mm	0.406 in	Gold Gold GXT™	9	Housing/Shell	4-40
Amphenol ICC (FCI) DEPO09P365GTXLF	-55 C	125 °C	Copper Alloy	1000 VDC	Thermoplastic	Signal	UL94 V-0	7.5 A	Solder	Plug Male Pins	D-Sub	2	1	DE E	Through Hole			Gold GXT™	9	Board Side (4-40)		Board Lock Grounding Indents	30 Áin	0.76 Ám
Amphenol ICC (FCI) DEPO09S565MGTLF	-55 C	125 °C	Copper Alloy	300 VDC	Thermoplastic	Signal	UL94 V-0	7.5 A	Solder	Receptacle Female Sockets	D-Sub	2	1	DE E	Right Angle Through Hole			Gold GXT™	9	Board Side (4-40)		Board Lock Mounting Brackets	30 Áin	0.76 Ám

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly