HMC-XDB112
UnknownX2 PASSIVE FREQUENCY MULTIPLIER CHIP, 20 - 30 GHZ OUTPUT
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HMC-XDB112
UnknownX2 PASSIVE FREQUENCY MULTIPLIER CHIP, 20 - 30 GHZ OUTPUT
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | HMC-XDB112 |
|---|---|
| Frequency [Max] | 15 GHz |
| Frequency [Min] | 10 GHz |
| Function | Frequency Multiplier |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| RF Type | VSAT, DBS |
| Supplier Device Package | Die |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
| Digikey | Tray | 25 | $ 46.53 | <2d |
| 50 | $ 44.85 | |||
| 75 | $ 43.92 | |||
| 125 | $ 42.78 | |||
| 175 | $ 42.06 | |||
Description
General part information
HMC-XDB112 Series
The HMC-XDB112 is a monolithic Passive Frequency Doubler which utilizes GaAs Heterojunction Bipolar Transistor (HBT) technology, and is targeted to high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized and the HBT devices are fully passivated for reliable operation.The HMC-XDB112 Passive Doubler MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.APPLICATIONSPoint-to-Point RadiosVSATTest InstrumentationMilitary & SpaceClock Generation
Documents
Technical documentation and resources