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ROHM BD10KA5WF-E2
Discrete Semiconductor Products

RS3E180ATTB1

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 18A, 150DEG C, 2W ROHS COMPLIANT: YES

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ROHM BD10KA5WF-E2
Discrete Semiconductor Products

RS3E180ATTB1

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 18A, 150DEG C, 2W ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRS3E180ATTB1
Current - Continuous Drain (Id) @ 25°C18 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs160 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]7200 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power Dissipation (Max) [Max]1.4 W
Rds On (Max) @ Id, Vgs5.4 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2442$ 3.45
NewarkEach (Supplied on Cut Tape) 1$ 3.54
10$ 2.31
25$ 2.18
50$ 1.90
100$ 1.61
250$ 1.55
500$ 1.31
1000$ 1.22

Description

General part information

RS3E180AT Series

RS3E180AT is a power MOSFET for switching applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Flammability of Materials

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Taping Information

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RS3E180AT ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

Certificate of not containing SVHC under REACH Regulation

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Part Explanation

Application Note

About Export Regulations

Export Information

Condition of Soldering / Land Pattern Reference

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data