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Discrete Semiconductor Products

IMZ1AT108

Active
Rohm Semiconductor

NPN+PNP, SOT-457, GENERAL PURPOSE AMPLIFICATION TRANSISTOR

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Product dimension image
Discrete Semiconductor Products

IMZ1AT108

Active
Rohm Semiconductor

NPN+PNP, SOT-457, GENERAL PURPOSE AMPLIFICATION TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationIMZ1AT108
Current - Collector (Ic) (Max) [Max]150 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition180 MHz, 140 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-457, SC-74
Power - Max [Max]300 mW
Supplier Device PackageSMT6
Transistor Type1 NPN, 1 PNP
Vce Saturation (Max) @ Ib, Ic500 mV, 400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.36
10$ 0.28
100$ 0.17
500$ 0.15
1000$ 0.10
Digi-Reel® 1$ 0.36
10$ 0.28
100$ 0.17
500$ 0.15
1000$ 0.10
N/A 9722$ 0.50
Tape & Reel (TR) 3000$ 0.10
6000$ 0.09
9000$ 0.08
30000$ 0.08
75000$ 0.08

Description

General part information

IMZ1 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Types and Features of Transistors

Application Note

Part Explanation

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Create Symbols for PSpice Models

Models

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Explanation for Marking

Package Information

ESD Data

Characteristics Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Inner Structure

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

IMZ1A Data Sheet

Data Sheet

Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

Package Dimensions

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

SMT6 Part Marking

Related Document