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252-FBGA (17x17)
Integrated Circuits (ICs)

R7F701275EABG-C#HC6

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Renesas Electronics Corporation

32BIT MCU RH850/C1X-S2 BGA252 T&

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252-FBGA (17x17)
Integrated Circuits (ICs)

R7F701275EABG-C#HC6

Active
Renesas Electronics Corporation

32BIT MCU RH850/C1X-S2 BGA252 T&

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationR7F701275EABG-C#HC6
ConnectivitySPI, SCI, CANbus, CSI, LINbus
Core ProcessorRH850G3MH
Core Size32-Bit Tri-Core
Data Converters12 b, 48
EEPROM Size64 K
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Oscillator TypeExternal, Internal
Package / Case252-FBGA
PeripheralsWDT, PWM, DMA
Program Memory Size4 MB
Program Memory TypeFLASH
RAM Size256 K
Speed320 MHz
Voltage - Supply (Vcc/Vdd) [Max]5.5 V
Voltage - Supply (Vcc/Vdd) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 750$ 18.40

Description

General part information

R7F701275 Series

RH850G3MH RH850/C1M-Ax Microcontroller IC 32-Bit Tri-Core 320MHz 4MB (4M x 8) FLASH 252-FBGA (17x17)

Documents

Technical documentation and resources