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ONSEMI NCS333ASQ3T2G
Discrete Semiconductor Products

UMP1NTR

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 25MA, 5PIN SWITCHING DIODE

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ONSEMI NCS333ASQ3T2G
Discrete Semiconductor Products

UMP1NTR

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 25MA, 5PIN SWITCHING DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationUMP1NTR
Current - Average Rectified (Io) (per Diode)25 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration2 Pair Common Anode
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOT-353, SC-70-5, 5-TSSOP
Reverse Recovery Time (trr)4 ns
Speed200 mA
SpeedAny Speed
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If [Max]900 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5625$ 0.62
NewarkEach (Supplied on Cut Tape) 1$ 0.59
10$ 0.37
25$ 0.33
50$ 0.29
100$ 0.24
250$ 0.21
500$ 0.19
1000$ 0.17

Description

General part information

UMP1N Series

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Package Dimensions

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

About Export Regulations

Export Information

UMP1N Data Sheet

Data Sheet

List of Diode Package Thermal Resistance

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Diodes

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Inner Structure

Package Information

Reliability Test Result

Manufacturing Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Diode Types and Applications

Technical Article

Taping Information

Package Information

Explanation for Marking

Package Information