Zenode.ai Logo
Mill-Max-316-93-133-61-001000 Connector Headers and PCB Receptacles Conn Socket Strip SKT 33 POS 2.54mm Solder ST Thru-Hole
RF and Wireless

HMC-ALH509

Obsolete
Analog Devices Inc./Maxim Integrated

RF AMP SINGLE LNA 86GHZ 3V 4-PIN DIE TRAY

Deep-Dive with AI

Search across all available documentation for this part.

Mill-Max-316-93-133-61-001000 Connector Headers and PCB Receptacles Conn Socket Strip SKT 33 POS 2.54mm Solder ST Thru-Hole
RF and Wireless

HMC-ALH509

Obsolete
Analog Devices Inc./Maxim Integrated

RF AMP SINGLE LNA 86GHZ 3V 4-PIN DIE TRAY

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationHMC-ALH509
Current - Supply50 mA
Frequency [Max]86 GHz
Frequency [Min]71 GHz
Gain14 dBi
Mounting TypeSurface Mount
Noise Figure5 dB
P1dB7 dBm
Package / CaseDie
RF TypeGeneral Purpose
Supplier Device PackageDie
Test Frequency [Max]86 GHz
Test Frequency [Min]71 GHz
Voltage - Supply2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated

Description

General part information

HMC-ALH509-DIE Series

The HMC-ALH509 is a three stage GaAs HEM T MMIC Low Noise Amplifier (LNA) which operates between 71 and 86 GHz. The HMC-ALH509 features 14 dB of small signal gain, 5 dB of noise figure and an output power of +7 dBm at 1dB compression from a +2V supply voltage. All bond pads and the die backside are Ti/Au metallized. This versatile LNA is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.ApplicationsShort Haul / High Capacity LinksAutomotive RadarE-Band Communication SystemsTest & Measurement

Documents

Technical documentation and resources