Zenode.ai Logo
Beta
361-FBGA Bottom
Integrated Circuits (ICs)

CY7C4142KV13-106FCXC

Active
INFINEON

SRAM 144MB, 1.3V, 106MHZ 4MX36 QDR-IV HP SRAM

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
361-FBGA Bottom
Integrated Circuits (ICs)

CY7C4142KV13-106FCXC

Active
INFINEON

SRAM 144MB, 1.3V, 106MHZ 4MX36 QDR-IV HP SRAM

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationCY7C4142KV13-106FCXC
Clock Frequency1066 MHz
Memory FormatSRAM
Memory InterfaceParallel
Memory Organization4 M
Memory Size18 MB
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case361-BBGA, FCBGA
Supplier Device Package361-FCBGA (21x21)
TechnologySRAM - Synchronous, QDR IV
Voltage - Supply [Max]1.34 V
Voltage - Supply [Min]1.26 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 359.62
Tray 300$ 333.36
MouserN/A 300$ 342.55

Description

General part information

CY7C4142 Series

The QDR™-IV XP (Xtreme Performance) SRAM is a high-performance memory device optimized to maximize the number of random transactions per second by the use of two independent bidirectional data ports. These ports are equipped with DDR interfaces and designated as port A and port B respectively. Accesses to these two data ports are concurrent and independent of each other. Access to each port is through a common address bus running at DDR. The control signals are running at SDR and determine if a read or write should be performed.

Documents

Technical documentation and resources