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Integrated Circuits (ICs)

BM1R00147F-E2

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Rohm Semiconductor

HIGH EFFICIENCY AND LOW STANDBY POWER, CCM CORRESPONDING SECONDARY SIDE SYNCHRONOUS RECTIFICATION CONTROLLER IC

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Product dimension image
Integrated Circuits (ICs)

BM1R00147F-E2

Active
Rohm Semiconductor

HIGH EFFICIENCY AND LOW STANDBY POWER, CCM CORRESPONDING SECONDARY SIDE SYNCHRONOUS RECTIFICATION CONTROLLER IC

Technical Specifications

Parameters and characteristics for this part

SpecificationBM1R00147F-E2
Fault ProtectionCurrent Limiting, Over Voltage, Over Temperature
Internal Switch(s)False
Mounting TypeSurface Mount
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-40 C
Output IsolationIsolated
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Supplier Device Package8-SOP
TopologyFlyback
Voltage - Start Up28 V
Voltage - Supply (Vcc/Vdd) [Max]32 V
Voltage - Supply (Vcc/Vdd) [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2500$ 1.95

Description

General part information

BM1R00147F Series

BM1R00147F is a synchronous rectification controller to be used in the secondary-side output. It has a built-in ultra-low consumption and high accuracy shunt regulator, which significantly reduces standby power. The shunt regulator is constructed in a completely independent chip that enables it to operate as a GND reference even when used in high side. At continuous mode operation, further space saving can be realized when operating without the input switching synchronizing signal of the primary side. BM1R00128F also features a wide operating power supply voltage range of 2.7V to 32V for various output applications. Finally, by adopting the high-voltage 120V process, it is possible to monitor the drain voltage directly."Clickherefor the board designed to fully evaluate BM1R00147F. In addition you can choose from a variety of power and topologyevaluation boards.

Documents

Technical documentation and resources

BM1R001xxF series Technical Design

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

BM1R00147F Evaluation Board (Low Side Type) User's Guide

User's Guide

Five Steps for Successful Thermal Design of IC

White Paper

What Is Thermal Design

Thermal Design

SOP8 Package Information

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Factory Information

Manufacturing Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Compliance with the ELV directive

Environmental Data

BM1R00147F Evaluation Board (High Side Type) User's Guide

User's Guide

UL94 Flame Classifications of Mold Compound

Environmental Data

BM1R00147F Data Sheet

Data Sheet

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

Thermal Resistance

Thermal Design