IRFR3910TRPBF
ActivePOWER MOSFET, N CHANNEL, 100 V, 16 A, 0.115 OHM, TO-252AA, SURFACE MOUNT
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IRFR3910TRPBF
ActivePOWER MOSFET, N CHANNEL, 100 V, 16 A, 0.115 OHM, TO-252AA, SURFACE MOUNT
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Technical Specifications
Parameters and characteristics for this part
| Specification | IRFR3910TRPBF |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 16 A |
| Drain to Source Voltage (Vdss) | 100 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 44 nC |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 175 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | TO-252-3, SC-63, DPAK (2 Leads + Tab) |
| Power Dissipation (Max) | 79 W |
| Rds On (Max) @ Id, Vgs | 115 mOhm |
| Supplier Device Package | TO-252AA (DPAK) |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 4 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.61 | |
| 10 | $ 1.02 | |||
| 100 | $ 0.68 | |||
| 500 | $ 0.54 | |||
| 1000 | $ 0.49 | |||
| Digi-Reel® | 1 | $ 1.61 | ||
| 10 | $ 1.02 | |||
| 100 | $ 0.68 | |||
| 500 | $ 0.54 | |||
| 1000 | $ 0.49 | |||
| N/A | 2820 | $ 0.73 | ||
| Tape & Reel (TR) | 2000 | $ 0.45 | ||
| 4000 | $ 0.42 | |||
| 6000 | $ 0.40 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 1.35 | |
| 10 | $ 0.91 | |||
| 25 | $ 0.82 | |||
| 50 | $ 0.73 | |||
| 100 | $ 0.64 | |||
| 250 | $ 0.59 | |||
| 500 | $ 0.55 | |||
| 1000 | $ 0.48 | |||
Description
General part information
IRFR3910 Series
The IRFR3910TRPBF is a HEXFET® fifth generation single N-channel Power MOSFET utilizes advanced processing techniques to achieve the lowest possible ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient device for use in a wide variety of applications. It is designed for surface-mounting using vapour phase, infrared or wave soldering techniques. Power dissipation level up to 1.5W is possible in typical surface-mount applications.
Documents
Technical documentation and resources