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CY62177G30-55ZXI
Integrated Circuits (ICs)

CY62177G30-55ZXI

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INFINEON

SRAM, 32MBIT, -40 TO 85DEG C ROHS COMPLIANT: YES

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CY62177G30-55ZXI
Integrated Circuits (ICs)

CY62177G30-55ZXI

Active
INFINEON

SRAM, 32MBIT, -40 TO 85DEG C ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationCY62177G30-55ZXI
Access Time55 ns
Memory FormatSRAM
Memory InterfaceParallel
Memory Organization2M x 16, 4M x 8
Memory Size4 MB
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Package / Case48-TFSOP
Package / Case [x]0.724 in
Package / Case [y]18.4 mm
Supplier Device Package48-TSOP I
TechnologySRAM - Asynchronous
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]2.2 V
Write Cycle Time - Word, Page55 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 21.43
Tray 96$ 48.39
NewarkEach 1$ 52.80

Description

General part information

CY62177 Series

Infineon's 32Mb density Ultra-Low-Power (ULP) SRAM with on-chip ECC offers high-performance and reliability for mission-critical industrial systems. With an industry-leading standby current of 19µA at +85°C, it ensures best-in-class battery lifetimes. This high-capacity parallel interface asynchronous SRAM, based on 65-nm technology, features embedded ECC and bit-interleaving, providing freedom from soft errors with < 0.1 FITs/Mbit.

Documents

Technical documentation and resources