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Discrete Semiconductor Products

QSX7TR

Active
Rohm Semiconductor

NPN+NPN, SOT-457T, DRIVER TRANSISTOR

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Product schematic image
Discrete Semiconductor Products

QSX7TR

Active
Rohm Semiconductor

NPN+NPN, SOT-457T, DRIVER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationQSX7TR
Current - Collector (Ic) (Max) [Max]1.5 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition400 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-6 Thin, TSOT-23-6
Power - Max [Max]500 mW
Supplier Device PackageTSMT6 (SC-95)
Transistor Type2 NPN (Dual)
Vce Saturation (Max) @ Ib, Ic200 mV
Voltage - Collector Emitter Breakdown (Max) [Max]12 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.21

Description

General part information

QSX7 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Export Regulations

Export Information

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

QSX7 Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

QSX7 ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

QSX7 Thermal Resistance

Characteristics Data

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Types and Features of Transistors

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

TSMT6_TR Taping Information

Package Information

How to Create Symbols for PSpice Models

Models

Two-Resistor Model for Thermal Simulation

Thermal Design

Inner Structure

Package Information

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information