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1199039
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1199039

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CHEMICALS EPOXY, DIE ATTACH ADHESIVE FOR CHIP BONDING, 1CC SYRINGE 5011/BARREL AND BUNG

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1199039
Tapes, Adhesives, Materials

1199039

Active
Phoenix Contact

CHEMICALS EPOXY, DIE ATTACH ADHESIVE FOR CHIP BONDING, 1CC SYRINGE 5011/BARREL AND BUNG

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification1199039
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Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 15.37
MouserN/A 104$ 16.56
250$ 15.59
500$ 14.61

Description

General part information

968-2 Series

CHEMICALS EPOXY, DIE ATTACH ADHESIVE FOR CHIP BONDING, 1CC SYRINGE 5011/BARREL AND BUNG

Documents

Technical documentation and resources