Specification	294151-E

Connector Type	Array, Male Pins
Contact Finish	Gold
Features	Pick and Place, Board Guide, Solder Retention
Height Above Board [z]	5.8 mm
Height Above Board [z]	0.228 in
Mounting Type	Surface Mount
Number of Positions	50
Number of Rows [custom]	2
Pitch	0.8 mm
Pitch	0.031 in

ERNI MicroCon Series

Part	Contact Finish	Pitch	Pitch	Features	Mounting Type	Height Above Board [z]	Height Above Board [z]	Connector Type	Number of Rows [custom]	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Insulation Height	Insulation Height	Termination	Contact Material	Contact Finish - Mating	Contact Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Row Spacing - Mating	Row Spacing - Mating	Insulation Material	Number of Positions Loaded	Contact Shape	Fastening Type	Contact Finish - Post	Insulation Color	Operating Temperature [Min]	Operating Temperature [Max]	Height Above Board	Height Above Board	Shrouding	Insulation Height	Material Flammability Rating	Insulation Height [z]	Insulation Height [z]
TE Connectivity AMP Connectors 294009-E	Gold	0.8 mm	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.157 in	4 mm	Array Female Sockets	2	100
TE Connectivity AMP Connectors 294257-E	Gold	0.8 mm	0.031 in	Solder Retention	Right Angle Surface Mount			Array Female Sockets Receptacle	2	50	157.5 Áin	4 Ám	4.4 mm	0.173 in	Solder	Copper Alloy	Gold	Female Socket	2.3 A	0.8 mm	0.031 in	1.25 mm	0.049 in	Liquid Crystal Polymer (LCP)	All	Rectangular	Push-Pull	Tin	Black	-55 C	125 °C
TE Connectivity AMP Connectors 454925-E	Gold	0.8 mm	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.236 in	6 mm	Array Female Sockets	2	16
TE Connectivity AMP Connectors 294133-E	Gold	0.8 mm	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount			Array Male Pins	2	12																						0.189 in	4.8 mm
TE Connectivity AMP Connectors 484618-E	Gold	0.8 mm	0.031 in	Board Guide Solder Retention	Surface Mount	0.543 in	13.8 mm	Array Male Pins Header	2	40	157.5 Áin	4 Ám		13.8 mm	Solder	Copper Alloy	Gold	Male Pin	2.3 A	0.8 mm	0.031 in	1.25 mm	0.049 in	Liquid Crystal Polymer (LCP)	All	Rectangular	Push-Pull	Tin	Black	-55 C	125 °C			Shrouded - 4 Wall	0.543 in	UL94 V-0
TE Connectivity AMP Connectors 294151-E	Gold	0.8 mm	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	5.8 mm	Array Male Pins	2	50
TE Connectivity AMP Connectors 484619-E	Gold	0.8 mm	0.031 in	Board Guide Solder Retention	Surface Mount	0.504 in	12.8 mm	Array Male Pins Header	2	40	157.5 Áin	4 Ám			Solder	Copper Alloy	Gold	Male Pin	2.3 A	0.8 mm	0.031 in	1.25 mm	0.049 in	Liquid Crystal Polymer (LCP)	All	Rectangular	Push-Pull	Tin	Black	-55 C	125 °C			Shrouded - 4 Wall		UL94 V-0	12.8 mm	0.504 "
TE Connectivity AMP Connectors 294256-E	Gold	0.8 mm	0.031 in	Solder Retention	Right Angle Surface Mount			Array Female Sockets Receptacle	2	40	157.5 Áin	4 Ám	4.4 mm	0.173 in	Solder	Copper Alloy	Gold	Female Socket	2.3 A	0.8 mm	0.031 in	1.25 mm	0.049 in	Liquid Crystal Polymer (LCP)	All	Rectangular	Push-Pull	Tin	Black	-55 C	125 °C
TE Connectivity AMP Connectors 294150-E	Gold	0.8 mm	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	5.8 mm	Array Male Pins	2	40
TE Connectivity AMP Connectors 294148-E	Gold	0.8 mm	0.031 in	Board Guide Pick and Place Solder Retention	Surface Mount	0.228 in	5.8 mm	Array Male Pins	2	26