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Technical Specifications

Parameters and characteristics for this part

SpecificationADRF5532BCPZN
FeaturesSPDT
Frequency (Max)2.7 GHz
Frequency (Min)2.3 GHz
Package / Case24-VFQFN Exposed Pad, CSP
Package Length5 mm
Package Name24-LFCSP
Package Width3 mm
RF TypeLTE

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyStrip 1$ 19.12<2d
10$ 16.66
25$ 15.81
100$ 14.63
250$ 13.93
500$ 13.44

CAD

3D models and CAD resources for this part

Description

General part information

ADRF5532 Series

The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.In the receive operation at 2.6 GHz, the LNA offers a low noise figure (NF) of 1.2 dB and a high gain of 35.5 dB with a third order input intercept point (IIP3) of −4 dBm.In the transmit operation, the switch provides a low insertion loss of 0.7 dB and handles a long-term evolution (LTE) average power of 36.5 dBm for a full lifetime operation (8 dB peak to average ratio (PAR)) and 39 dBm for a single event (<10 sec) LNA protection operation.The device is featured in an RoHS compliant, compact, 5 mm × 3 mm, 24-lead LFCSP package.APPLICATIONSWireless infrastructureTDD massive multiple input and multiple output (MIMO) and active antenna systemsTDD-based communication systems