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RF4C050APTR
Discrete Semiconductor Products

RF4C050APTR

Active
Rohm Semiconductor

PCH -20V -10A MIDDLE POWER MOSFET

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RF4C050APTR
Discrete Semiconductor Products

RF4C050APTR

Active
Rohm Semiconductor

PCH -20V -10A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRF4C050APTR
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On) [Max]1.8 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]55 nC
Input Capacitance (Ciss) (Max) @ Vds5500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerUDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs26 mOhm
Supplier Device PackageHUML2020L8
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]-8 V
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3501$ 0.83

Description

General part information

RF4C050AP Series

The high power small mold package RF4C050AP is suitable for switching and load switch.

Documents

Technical documentation and resources

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Taping Information

Package Information

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

RF4C050AP Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Package Dimensions

Package Information

P-channel Power MOSFETs selection guide

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Explanation for Marking

Package Information

ESD Data

Characteristics Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models