RF and Wireless

MGM210PA32JIA2

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MULTIPROTOCOL MODULES WIRELESS GECKO MULTI-PROTOCOL MODULE, +20 DBM, 2.4 GHZ, 1 MB FLASH, -40 TO 125 C, BUILT-IN ANTENNA, CERTIFIED.

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RF and Wireless

MGM210PA32JIA2

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SILICON LABS

MULTIPROTOCOL MODULES WIRELESS GECKO MULTI-PROTOCOL MODULE, +20 DBM, 2.4 GHZ, 1 MB FLASH, -40 TO 125 C, BUILT-IN ANTENNA, CERTIFIED.

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	MGM210PA32JIA2

Antenna Type	Chip, Integrated
Current - Receiving [Max]	9.9 mA
Current - Receiving [Min]	9.1 mA
Current - Transmitting [Max]	181.3 mA
Current - Transmitting [Min]	59.7 mA
Data Rate	2 MBd
Frequency [Max]	2.4835 GHz
Frequency [Min]	2.4 GHz
Memory Size	1 MB, 96 kB
Modulation	O-QPSK, GFSK, DSSS
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	31-SMD Module
Power - Output	20 dBm
Protocol	Bluetooth v5.3, Zigbee®, Thread
RF Family/Standard	802.15.4, Bluetooth
Sensitivity	-104.5 dBm
Serial Interfaces	I2S, ADC, SPI, PWM, GPIO, IrDA, I2C, UART
Utilized IC / Part	EFR32MG21
Voltage - Supply [Max]	3.8 V
Voltage - Supply [Min]	1.71 V

MGM210 Series

Part	Frequency [Max]	Frequency [Min]	RF Family/Standard	Protocol	Data Rate	Antenna Type	Serial Interfaces	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Utilized IC / Part	Memory Size	Current - Receiving [Min]	Current - Receiving [Max]	Voltage - Supply [Min]	Voltage - Supply [Max]	Current - Transmitting	Modulation	Mounting Type	Sensitivity	Power - Output	Current - Transmitting [Min] [x]	Current - Transmitting [Max] [x]	Current - Transmitting [Max]	Current - Transmitting [Min]
SILICON LABS MGM210L022JIF2R	2.4835 GHz	2.4 GHz	802.15.4 Bluetooth	Bluetooth v5.1 Thread Zigbee®	2 MBd	PCB Trace	ADC GPIO I2C I2S IrDA PWM SPI UART	18-SMD Module	125 °C	-40 °C	EFR32MG21	1 MB 96 kB	9.1 mA	9.9 mA	1.8 V	3.8 V	70 mA	DSSS GFSK O-QPSK	Surface Mount	-104.4 dBm	12.5 dBm
SILICON LABS MGM210L022JIF2	2.4835 GHz	2.4 GHz	802.15.4 Bluetooth	Bluetooth v5.1 Thread Zigbee®	2 MBd	PCB Trace	ADC GPIO I2C I2S IrDA PWM SPI UART	18-SMD Module	125 °C	-40 °C	EFR32MG21	1 MB 96 kB	9.1 mA	9.9 mA	1.8 V	3.8 V	70 mA	DSSS GFSK O-QPSK	Surface Mount	-104.4 dBm	12.5 dBm
SILICON LABS MGM210PA22JIA2	2.4835 GHz	2.4 GHz	802.15.4 Bluetooth	Bluetooth v5.3 Thread Zigbee®	2 MBd	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	31-SMD Module	125 °C	-40 °C	EFR32MG21	1 MB 96 kB	9.1 mA	9.9 mA	1.71 V	3.8 V		DSSS GFSK O-QPSK	Surface Mount	-104.5 dBm	10 dBm	16.1 mA	34.1 mA
SILICON LABS MGM210PA32JIA2R	2.4835 GHz	2.4 GHz	802.15.4 Bluetooth	Bluetooth v5.3 Thread Zigbee®	2 MBd	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	31-SMD Module	125 °C	-40 °C	EFR32MG21	1 MB 96 kB	9.1 mA	9.9 mA	1.71 V	3.8 V		DSSS GFSK O-QPSK	Surface Mount	-104.5 dBm	20 dBm			181.3 mA	59.7 mA
SILICON LABS MGM210PA22JIA2R	2.4835 GHz	2.4 GHz	802.15.4 Bluetooth	Bluetooth v5.3 Thread Zigbee®	2 MBd	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	31-SMD Module	125 °C	-40 °C	EFR32MG21	1 MB 96 kB	9.1 mA	9.9 mA	1.71 V	3.8 V		DSSS GFSK O-QPSK	Surface Mount	-104.5 dBm	10 dBm	16.1 mA	34.1 mA
SILICON LABS MGM210PA32JIA2	2.4835 GHz	2.4 GHz	802.15.4 Bluetooth	Bluetooth v5.3 Thread Zigbee®	2 MBd	Chip Integrated	ADC GPIO I2C I2S IrDA PWM SPI UART	31-SMD Module	125 °C	-40 °C	EFR32MG21	1 MB 96 kB	9.1 mA	9.9 mA	1.71 V	3.8 V		DSSS GFSK O-QPSK	Surface Mount	-104.5 dBm	20 dBm			181.3 mA	59.7 mA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	2	$ 12.55
	Strip	1	$ 12.17
		10	$ 11.02
		25	$ 10.15
		100	$ 9.28
		250	$ 8.70
		500	$ 8.12
		1000	$ 7.71
Mouser	N/A	1	$ 13.26
		10	$ 11.99
		50	$ 11.04
		100	$ 10.10
		200	$ 9.47
		500	$ 8.84
		1000	$ 8.60

Description

General part information

MGM210 Series

802.15.4, Bluetooth Bluetooth v5.3, Thread, Zigbee® Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount

Documents

Technical documentation and resources