SPC5517EAVLU66
ActiveMCU 32-BIT MPC55XX E200 RISC 1536KB FLASH 3.3V/5V 176-PIN LQFP TRAY
Deep-Dive with AI
Search across all available documentation for this part.
SPC5517EAVLU66
ActiveMCU 32-BIT MPC55XX E200 RISC 1536KB FLASH 3.3V/5V 176-PIN LQFP TRAY
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SPC5517EAVLU66 |
|---|---|
| Connectivity | CANbus, SPI, SCI, I2C, EBI/EMI |
| Core Processor | e200z0, e200z1 |
| Core Size [custom] | 32-Bit Dual-Core |
| Data Converters | 12 b, 40 x |
| Mounting Type | Surface Mount |
| Number of I/O | 137 |
| Operating Temperature [Max] | 105 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 176-LQFP |
| Peripherals | WDT, DMA, PWM, POR |
| Program Memory Size | 1.5 MB |
| Program Memory Type | FLASH |
| RAM Size | 80 K |
| Speed | 66 MHz |
| Supplier Device Package | 176-LQFP (24x24) |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.25 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 4.5 V |
| Part | Number of I/O | Core Size [custom] | Core Processor | Program Memory Type | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] | Package / Case | Mounting Type | RAM Size | Operating Temperature [Max] | Operating Temperature [Min] | Program Memory Size | Supplier Device Package | Data Converters | Oscillator Type | Connectivity | Peripherals | Speed | Core Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 137 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 176-LQFP | Surface Mount | 80 K | 105 °C | -40 °C | 1.5 MB | 176-LQFP (24x24) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | |
 Freescale Semiconductor - NXP | 111 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 144-LQFP | Surface Mount | 80 K | 105 °C | -40 °C | 1.5 MB | 144-LQFP (20x20) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | |
 Freescale Semiconductor - NXP | 144 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 208-BGA | Surface Mount | 80 K | 125 °C | -40 °C | 1.5 MB | 208-BGA (17x17) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 80 MHz | |
Freescale Semiconductor - NXP | 137 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 176-LQFP | Surface Mount | 80 K | 125 °C | -40 °C | 1.5 MB | 176-LQFP (24x24) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | |
Freescale Semiconductor - NXP | 111 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 144-LQFP | Surface Mount | 80 K | 125 °C | -40 °C | 1.5 MB | 144-LQFP (20x20) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | |
Freescale Semiconductor - NXP | 144 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 208-BGA | Surface Mount | 80 K | 125 °C | -40 °C | 1.5 MB | 208-BGA (17x17) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | |
Freescale Semiconductor - NXP | 111 | e200z1 | FLASH | 4.5 V | 5.25 V | 144-LQFP | Surface Mount | 64 K | 125 °C | -40 °C | 1.5 MB | 144-LQFP (20x20) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | 32-Bit Single-Core | |
Freescale Semiconductor - NXP | 111 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 208-BGA | Surface Mount | 80 K | 105 °C | -40 °C | 1.5 MB | 208-BGA (17x17) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | |
Freescale Semiconductor - NXP | 137 | e200z1 | FLASH | 4.5 V | 5.25 V | 176-LQFP | Surface Mount | 64 K | 125 °C | -40 °C | 1.5 MB | 176-LQFP (24x24) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz | 32-Bit Single-Core | |
Freescale Semiconductor - NXP | 111 | 32-Bit Dual-Core | e200z0 e200z1 | FLASH | 4.5 V | 5.25 V | 144-LQFP | Surface Mount | 80 K | 125 °C | -40 °C | 1.5 MB | 144-LQFP (20x20) | 12 b 40 x | Internal | CANbus EBI/EMI I2C SCI SPI | DMA POR PWM WDT | 66 MHz |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
SPC5517 Series
The Freescale MPC5510 MCU belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle. Offers high-performance while continuing to meet low-power requirements Enables centralized architectures, which reduce the number of distributed ECUs and complexity of vehicle architectures Provides extensive communication capabilities (e.g., FlexRay, multiple CAN and LIN support) Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash Backed by a third-party ecosystem of development tools and softwarePower Architecture e200z1 core with variable length encoding (VLE)Optional VLE-only 32/16-bit e200z0 secondary core16-channel eDMA (enhanced direct memory access)Memory management unit (MMU) with 4-entry translation look-aside buffer (TLB)Multiple low-power modesJTAG and Nexus class 2+ debug supportUp to 1.5 MB of flash with error correction coding (ECC)The flash module features read while write (RWW) and small partitions for optimal bootloader and EEPROM emulation supportUp to 80 KB of SRAM with ECCMemory protection unit (MPU) with up to 16 regions and 32B granularity
Documents
Technical documentation and resources