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IXYS-MMIX1T550N055T2 MOSFETs Trans MOSFET N-CH 55V 550A 21-Pin SMPD-X
Discrete Semiconductor Products

MMIX1F210N30P3

Active
LITTELFUSE

DISC MSFT SMPD PKG-HIPERFETMSFT SMPD-B/ TUBE

IXYS-MMIX1T550N055T2 MOSFETs Trans MOSFET N-CH 55V 550A 21-Pin SMPD-X
Discrete Semiconductor Products

MMIX1F210N30P3

Active
LITTELFUSE

DISC MSFT SMPD PKG-HIPERFETMSFT SMPD-B/ TUBE

Technical Specifications

Parameters and characteristics for this part

SpecificationMMIX1F210N30P3
Current - Continuous Drain (Id) @ 25°C108 A
Drain to Source Voltage (Vdss)300 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds16200 pF
Mounting TypeSurface Mount
Package / Case24-PowerSMD, 21 Leads
Rds On (Max) @ Id, Vgs16 mOhm
Supplier Device Package24-SMPD
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyN/A 0$ 34.561m+
Tube 300$ 37.701m+
NewarkEach 250$ 36.221m+

Description

General part information

MMIX1F210N30P3 Series

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single