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ISL8200MIRZ
Power Supplies - Board Mount

ISL8200MIRZ

Obsolete
Renesas Electronics Corporation

COMPLETE CURRENT SHARE 10A DC/DC POWER MODULE

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ISL8200MIRZ
Power Supplies - Board Mount

ISL8200MIRZ

Obsolete
Renesas Electronics Corporation

COMPLETE CURRENT SHARE 10A DC/DC POWER MODULE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationISL8200MIRZ
ApplicationsITE (Commercial)
Current - Output (Max) [Max]10 A
FeaturesOCP, UVLO, OTP, OVP
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case23-PowerQFN Module
Size / Dimension [x]15 mm
Size / Dimension [x]0.59 in
Size / Dimension [y]15 mm
Size / Dimension [y]0.59 in
Size / Dimension [z]2.2 mm
Size / Dimension [z]0.09 "
Supplier Device Package23-QFN (15x15)
TypeNon-Isolated PoL Module
Voltage - Input (Max) [Max]20 V
Voltage - Input (Min) [Min]4.5 V
Voltage - Output 1 [Max]6 V
Voltage - Output 1 [Min]0.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

ISL8200M Series

The ISL8200M is a simple and easy to use high power, current-sharing DC\DC power module for Datacom\Telecom\ FPGA power hungry applications. All that is needed is the ISL8200M, a few passive components and one VOUTsetting resistor to have a complete 10A design ready for market. The ease of use virtually eliminates the design and manufacturing risks while dramatically improving time to market. Need more output current? Parallel up to six ISL8200M modules to scale up to a 60A solution (see Figure 6 on page 10). The simplicity of the ISL8200M is in its Off The Shelf, unassisted implementation versus a discrete implementation. Patented current sharing in multi-phase operation greatly reduces ripple currents, BOM cost and complexity. For example, parallel 2 for 20A and up to 6 for 60A. The output voltage can be precisely regulated to as low as 0. 6V with ±1% output voltage regulation over line, load, and temperature variations. The ISL8200M’s thermally enhanced, compact QFN package, operates at full load and over temperature, without requiring forced air cooling. It's so thin it can even fit on the back side of the PCB. Easy access to all pins with few external components, reduces the PCB design to a component layer and a simple ground layer.

Documents

Technical documentation and resources