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HP8KF7HTB1
Discrete Semiconductor Products

HP8KF7HTB1

Active
Rohm Semiconductor

150V 18.5A, DUAL NCH+NCH, HSOP8, POWER MOSFET

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HP8KF7HTB1
Discrete Semiconductor Products

HP8KF7HTB1

Active
Rohm Semiconductor

150V 18.5A, DUAL NCH+NCH, HSOP8, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8KF7HTB1
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C6 A, 18.5 A
Drain to Source Voltage (Vdss)150 V
Gate Charge (Qg) (Max) @ Vgs [Max]20 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1100 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max3 W, 26 W
Rds On (Max) @ Id, Vgs62 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2500$ 3.78

Description

General part information

HP8KF7H Series

HP8KF7H is a low on-resistance MOSFET ideal for Switching and Motor drives applications.

Documents

Technical documentation and resources

HP8KF7HTB1 | Datasheet

Datasheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Explanation for Marking

Package Information

Taping Information

Package Information

P-channel Power MOSFETs selection guide

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

HSOP8(Symmetry Dual) Condition of Soldering / Land Pattern Reference

Package Information

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

HP8KF7H ESD Data

Characteristics Data

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data