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8-SOIC
Discrete Semiconductor Products

RXH100N03TB1

Active
Rohm Semiconductor

4V DRIVE NCH MOSFET: MOSFETS ARE

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8-SOIC
Discrete Semiconductor Products

RXH100N03TB1

Active
Rohm Semiconductor

4V DRIVE NCH MOSFET: MOSFETS ARE

Technical Specifications

Parameters and characteristics for this part

SpecificationRXH100N03TB1
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs11 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]800 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs13 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.09
10$ 1.34
100$ 0.91
500$ 0.72
1000$ 0.66
Digi-Reel® 1$ 2.09
10$ 1.34
100$ 0.91
500$ 0.72
1000$ 0.66
N/A 2402$ 1.56
Tape & Reel (TR) 2500$ 0.55

Description

General part information

RXH100N03 Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

ESD Data

Characteristics Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

Anti-Whisker formation - Transistors

Package Information

Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

How to Create Symbols for PSpice Models

Models

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Reliability Test Result

Manufacturing Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

Types and Features of Transistors

Application Note

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Constitution Materials List

Environmental Data

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Inner Structure

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

RXH100N03 Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design