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Discrete Semiconductor Products

RFN3LB6STBR1

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Rohm Semiconductor

600V 3A 16NS, DO-214AA(SMB), SUPER FAST RECOVERY DIODE

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Product dimension image
Discrete Semiconductor Products

RFN3LB6STBR1

Active
Rohm Semiconductor

600V 3A 16NS, DO-214AA(SMB), SUPER FAST RECOVERY DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN3LB6STBR1
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr1 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSMB, DO-214AA
Reverse Recovery Time (trr)35 ns
Speed500 ns, 200 mA
Supplier Device PackageSMBP
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]1.75 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3000$ 1.18

Description

General part information

RFN3LB6S Series

RFN3LB6S is a silicon epitaxial planar type super fast recovery diode featuring low VFand low switching loss. Ideal for general rectification applications.

Documents

Technical documentation and resources

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

Power Loss and Thermal Design of Diodes

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

Diode Types and Applications

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

RFN3LB6S Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Select Rectifier Diodes

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design