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Technical Specifications
Parameters and characteristics for this part
| Specification | TPS65811RTQT |
|---|---|
| Battery Chemistry [custom] | Lithium Ion/Polymer |
| Fault Protection | Over Voltage, Over Current |
| Function | Multi-Function Controller |
| Interface | USB, I2C |
| Mounting Type | Surface Mount |
| Number of Cells | 1 |
| Operating Temperature [Max] | 85 C |
| Operating Temperature [Min] | -40 ¯C |
| Package / Case | 56-VFQFN Exposed Pad |
| Supplier Device Package | 56-QFN (8x8) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 14.32 | |
| N/A | 0 | $ 14.72 | ||
| Tape & Reel (TR) | 250 | $ 10.57 | ||
| 500 | $ 9.89 | |||
Description
General part information
TPS65811 Series
The TPS65810 device provides an easy-to-use, fully-integrated solution for handheld devices, integrating charge management, multiple regulated power supplies, system management, and display functions in a small, thermally-enhanced 8-mm × 8-mm package. The high level of integration enables space savings of 70% of the typical board area when compared to equivalent discrete solutions, while implementing a high-performance and flexible solution that is portable across multiple platforms.
If required, an external host can control the TPS65810 device through I2C interface with access to all integrated systems. The I2C enables the setting of the output voltages, current thresholds, and operation modes. The internal registers have a complete set of status information, enabling easy diagnostics, and host-controlled handling of fault conditions. The TPS65810 device can operate in standalone mode, with no external host control, if the internal power-up defaults are compatible with the system requirements.
The TPS65810 device provides an easy-to-use, fully-integrated solution for handheld devices, integrating charge management, multiple regulated power supplies, system management, and display functions in a small, thermally-enhanced 8-mm × 8-mm package. The high level of integration enables space savings of 70% of the typical board area when compared to equivalent discrete solutions, while implementing a high-performance and flexible solution that is portable across multiple platforms.
Documents
Technical documentation and resources