Connectors, Interconnects

100-032-050

Obsolete

CONN IC DIP SOCKET 32POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 32POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	100-032-050

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	8 µin
Contact Finish Thickness - Mating	0.203 µm
Contact Finish Thickness - Post	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	32
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length [x]	3.2 mm
Termination Post Length [x]	0.126 in
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

Part	Termination Post Length [x]	Termination Post Length [x]	Current Rating (Amps)	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Mounting Type	Contact Material - Mating	Features	Contact Finish - Post	Housing Material	Type [custom]	Type [custom]	Type	Contact Finish - Mating	Contact Material - Post [custom]
3M Electronic Specialty 100-032-001	3.2 mm	0.126 in	1 A	UL94 V-0	0.1 "	2.54 mm	Solder	8 µin	0.203 µm	Flash	32	-65 ░C	125 °C	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Closed Frame Seal Tape	Gold	Polyphenylene Sulfide (PPS) Glass Filled	15.24 mm	0.6 in	DIP	Gold	Brass
3M Electronic Specialty 100-032-050	3.2 mm	0.126 in	1 A	UL94 V-0	0.1 "	2.54 mm	Solder	8 µin	0.203 µm	Flash	32	-65 ░C	125 °C	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Open Frame	Gold	Polyphenylene Sulfide (PPS) Glass Filled	15.24 mm	0.6 in	DIP	Gold	Brass
3M Electronic Specialty 100-032-000	3.2 mm	0.126 in	1 A	UL94 V-0	0.1 "	2.54 mm	Solder	8 µin	0.203 µm	Flash	32	-65 ░C	125 °C	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Open Frame	Gold	Polyphenylene Sulfide (PPS) Glass Filled	15.24 mm	0.6 in	DIP	Gold	Brass

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

General part information

32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available