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Discrete Semiconductor Products

SH8MA3TB1

Active
Rohm Semiconductor

MOSFET, N/P-CH, 30V, 7A, 150DEG C, 2.8W ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

SH8MA3TB1

Active
Rohm Semiconductor

MOSFET, N/P-CH, 30V, 7A, 150DEG C, 2.8W ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationSH8MA3TB1
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C7 A, 6 A
Drain to Source Voltage (Vdss)30 V
Gate Charge (Qg) (Max) @ Vgs7.2 nC, 10 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]480 pF
Input Capacitance (Ciss) (Max) @ Vds [Min]300 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs50 mOhm, 28 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 16691$ 1.03
NewarkEach (Supplied on Cut Tape) 1$ 1.01
10$ 0.82
25$ 0.75
50$ 0.67
100$ 0.59
250$ 0.54
500$ 0.48
1000$ 0.44

Description

General part information

SH8MA3 Series

SH8MA3TB1 is low on-resistance and small surface mount package MOSFET. It is suitable for switching.

Documents

Technical documentation and resources

Reliability Test Result

Manufacturing Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Types and Features of Transistors

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Taping Information

Package Information

P-channel Power MOSFETs selection guide

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

SH8MA3 Data Sheet

Data Sheet

How to Use LTspice® Models

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

SH8MA3 ESD Data

Characteristics Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Package Dimensions

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Explanation for Marking

Package Information

Anti-Whisker formation - Transistors

Package Information

SOP8 Dual Cu Inner Structure

Package Information