Specification	R6010YNX3C16

Current - Continuous Drain (Id) @ 25°C	10 A
Drain to Source Voltage (Vdss)	600 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 12 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs	15 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]	600 pF
Mounting Type	Through Hole
Operating Temperature	150 °C
Package / Case	TO-220-3
Power Dissipation (Max)	92 W
Rds On (Max) @ Id, Vgs	390 mOhm
Supplier Device Package	TO-220AB
Technology	MOSFET (Metal Oxide)
Vgs (Max)	30 V
Vgs(th) (Max) @ Id	6 V

R6010YNX3 Series

600V 10A TO-220AB, High-speed switching Power MOSFET

Part	FET Type	Vgs (Max)	Supplier Device Package	Current - Continuous Drain (Id) @ 25°C	Vgs(th) (Max) @ Id	Mounting Type	Operating Temperature	Package / Case	Drive Voltage (Max Rds On, Min Rds On)	Drain to Source Voltage (Vdss)	Input Capacitance (Ciss) (Max) @ Vds [Max]	Gate Charge (Qg) (Max) @ Vgs	Technology	Power Dissipation (Max)	Rds On (Max) @ Id, Vgs
Rohm Semiconductor R6010YNX3C16	N-Channel	30 V	TO-220AB	10 A	6 V	Through Hole	150 °C	TO-220-3	10 V 12 V	600 V	600 pF	15 nC	MOSFET (Metal Oxide)	92 W	390 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	940	$ 3.32
	Tube	1	$ 3.46
		10	$ 2.26
		25	$ 1.95
		100	$ 1.60
		300	$ 1.40
		500	$ 1.32
		1000	$ 1.24
		2500	$ 1.15
		5000	$ 1.09
Newark	Each	1	$ 2.65
		10	$ 2.12
		100	$ 1.90
		500	$ 1.63
		1000	$ 1.45

Description

General part information

R6010YNX3 Series

R6010YNX3 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Datasheet

TO-220AB Reliability Test Result

Manufacturing Data

Types and Features of Transistors

Application Note

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Anti-Whisker formation - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

R6010YNX3C16

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R6010YNX3C16

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Technical Specifications

R6010YNX3 Series

Pricing

Description

R6010YNX3 Series

Documents

Datasheet

TO-220AB Reliability Test Result

Types and Features of Transistors

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

How to Use LTspice&reg; Models: Tips for Improving Convergence

What is a Thermal Model? (Transistor)

Measurement Method and Usage of Thermal Resistance RthJC

MOSFET Gate Drive Current Setting for Motor Driving

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

Moisture Sensitivity Level - Transistors

Notes for Calculating Power Consumption:Static Operation

Calculation of Power Dissipation in Switching Circuit

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Compliance of the RoHS directive

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Method for Monitoring Switching Waveform

TO-220AB Packing Information

Importance of Probe Calibration When Measuring Power: Deskew

How to Use LTspice&reg; Models

TO-220AB Inner Structure

About Flammability of Materials

Judgment Criteria of Thermal Evaluation

Two-Resistor Model for Thermal Simulation

What Is Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Impedance Characteristics of Bypass Capacitor

θ<sub>JA</sub> and Ψ<sub>JT</sub>

TO-220AB Dimension

Part Explanation

About Export Regulations

Condition of Soldering / Land Pattern Reference

Notes for Temperature Measurement Using Thermocouples

TO-220AB Explanation for Marking

List of Transistor Package Thermal Resistance

Temperature derating method for Safe Operating Area (SOA)

Precautions When Measuring the Rear of the Package with a Thermocouple

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Report of SVHC under REACH Regulation

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Anti-Whisker formation - Transistors

PCB Layout Thermal Design Guide

Basics of Thermal Resistance and Heat Dissipation

R6010YNX3 Series

How to Use LTspice® Models: Tips for Improving Convergence

How to Use LTspice® Models