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ROHM 2SB1188T100Q
Discrete Semiconductor Products

RJP020N06T100

Active
Rohm Semiconductor

POWER MOSFET, N CHANNEL, 60 V, 2 A, 0.165 OHM, SOT-89, SURFACE MOUNT

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ROHM 2SB1188T100Q
Discrete Semiconductor Products

RJP020N06T100

Active
Rohm Semiconductor

POWER MOSFET, N CHANNEL, 60 V, 2 A, 0.165 OHM, SOT-89, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationRJP020N06T100
Current - Continuous Drain (Id) @ 25°C2 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On) [Max]2.5 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]10 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]160 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-243AA
Power Dissipation (Max)500 mW
Rds On (Max) @ Id, Vgs240 mOhm
Supplier Device PackageMPT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 12878$ 1.41
NewarkEach (Supplied on Cut Tape) 1$ 1.02
10$ 0.77
25$ 0.70
50$ 0.62
100$ 0.55
250$ 0.49
500$ 0.44
1000$ 0.34

Description

General part information

RJP020N06 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Inner Structure

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

Explanation for Marking

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design