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ROHM Semiconductor-DAN235FMT106 PIN Diodes PIN Diode Switch 35V 3-Pin UMD
Discrete Semiconductor Products

DAN235FMT106

Active
Rohm Semiconductor

SMALL SIGNAL SWITCHING DIODES 35V 1.2PF, UMD3, CATHODE COMMON, LOW RF BAND SWITCHING DIODES

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Search across all available documentation for this part.

DocumentsDAN235FMT106 Datasheet (PDF)Notes for Temperature Measurement Using Thermocouples+33
ROHM Semiconductor-DAN235FMT106 PIN Diodes PIN Diode Switch 35V 3-Pin UMD
Discrete Semiconductor Products

DAN235FMT106

Active
Rohm Semiconductor

SMALL SIGNAL SWITCHING DIODES 35V 1.2PF, UMD3, CATHODE COMMON, LOW RF BAND SWITCHING DIODES

Deep-Dive with AI

DocumentsDAN235FMT106 Datasheet (PDF)Notes for Temperature Measurement Using Thermocouples+33

Technical Specifications

Parameters and characteristics for this part

SpecificationDAN235FMT106
Capacitance @ Vr, F1.2 pF
Diode TypeStandard - 1 Pair Common Cathode
GradeAutomotive
Operating Temperature150 °C
Package / CaseSOT-323, SC-70
Power Dissipation (Max) [Max]200 mW
QualificationAEC-Q101
Resistance @ If, F900 mOhm
Supplier Device PackageSOT-323
Voltage - Peak Reverse (Max) [Max]35 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2672$ 0.48
MouserN/A 1$ 0.42
10$ 0.33
100$ 0.22
500$ 0.17
1000$ 0.13
3000$ 0.12
6000$ 0.11
9000$ 0.10
24000$ 0.09
NewarkEach (Supplied on Cut Tape) 1$ 0.58
10$ 0.37
25$ 0.33
50$ 0.29
100$ 0.26
250$ 0.23
500$ 0.20
1000$ 0.18

Description

General part information

DAN235FM Series

DAN235FM is suitable for High frequency switching Band Switching diode.

Documents

Technical documentation and resources

DAN235FMT106 Datasheet (PDF)

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Part Explanation

Application Note

About Export Regulations

Export Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

Taping Information

Package Information

Anti-Whisker formation - Diodes

Package Information

What Is Thermal Design

Thermal Design

Reliability Test Result

Manufacturing Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Diode Types and Applications

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design