Connectors, Interconnects

100-010-000

Obsolete

CONN IC DIP SOCKET 10POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 10POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	100-010-000

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	8 µin
Contact Finish Thickness - Mating	0.203 µm
Contact Finish Thickness - Post	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	10
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	5
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length [x]	3.2 mm
Termination Post Length [x]	0.126 in
Type	7.62 mm
Type	0.3 in
Type	DIP

Part	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Type	Type	Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination	Contact Material - Post [custom]	Contact Finish Thickness - Post	Housing Material	Mounting Type	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Features
3M Electronic Specialty 100-010-050	3.2 mm	0.126 in	UL94 V-0	1 A	Gold	7.62 mm	0.3 in	DIP	Gold	8 µin	0.203 µm	0.1 "	2.54 mm	Solder	Brass	Flash	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.1 in	2.54 mm	5	10	2	-65 ░C	125 °C	Beryllium Copper	Open Frame
3M Electronic Specialty 100-010-000	3.2 mm	0.126 in	UL94 V-0	1 A	Gold	7.62 mm	0.3 in	DIP	Gold	8 µin	0.203 µm	0.1 "	2.54 mm	Solder	Brass	Flash	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.1 in	2.54 mm	5	10	2	-65 ░C	125 °C	Beryllium Copper	Open Frame

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

General part information

10 (2 x 5) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available