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RD3H080SPFRATL
Discrete Semiconductor Products

RD3H080SPFRATL

Active
Rohm Semiconductor

MOSFET, AEC-Q101, P-CH, 45V, 8A, TO-252 ROHS COMPLIANT: YES

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RD3H080SPFRATL
Discrete Semiconductor Products

RD3H080SPFRATL

Active
Rohm Semiconductor

MOSFET, AEC-Q101, P-CH, 45V, 8A, TO-252 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3H080SPFRATL
Current - Continuous Drain (Id) @ 25°C8 A
Drain to Source Voltage (Vdss)45 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs9 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]1000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)15 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs91 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1473$ 1.76
NewarkEach (Supplied on Cut Tape) 1$ 1.85
10$ 1.22
25$ 1.09
50$ 0.97
100$ 0.85
250$ 0.78
500$ 0.70
1000$ 0.66

Description

General part information

RD3H080SPFRA Series

RD3H080SPFRA is a power MOSFET with low on - resistance, suitable for switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Export Regulations

Export Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

TO-252_TL Taping Information

Package Information

Report of SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

RD3H080SPFRA ESD Data

Characteristics Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice&reg; Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Transistor)

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Inner Structure

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

Explanation for Marking

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Package Dimensions

Package Information

Anti-Whisker formation - Transistors

Package Information