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20-SOIC(exposed pad, bottom)
Integrated Circuits (ICs)

TPA1517DWPRG4

Unknown
Texas Instruments

IC AMP CLASS AB STER 6W 20SOPWR

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20-SOIC(exposed pad, bottom)
Integrated Circuits (ICs)

TPA1517DWPRG4

Unknown
Texas Instruments

IC AMP CLASS AB STER 6W 20SOPWR

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationTPA1517DWPRG4
FeaturesMute, Standby, Thermal Protection
Max Output Power x Channels @ Load6 W
Max Output Power x Channels @ Load [x]2
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type2-Channel (Stereo)
Package / Case20-SOIC
Package / Case [diameter]7.5 mm
Supplier Device Package20-HSOIC
TypeClass AB
Voltage - Supply [Max]18 V
Voltage - Supply [Min]9.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2000$ 1.95

Description

General part information

TPA1517 Series

The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W per channel of continuous average power into a 4-load at 10% THD+N or 5 W per channel at 1% THD+N. The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package (DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).

The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W per channel of continuous average power into a 4-load at 10% THD+N or 5 W per channel at 1% THD+N. The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package (DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).

Documents

Technical documentation and resources

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