Integrated Circuits (ICs)

74LVC1G34GX4Z

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IC BUFF NON-INVERT 5.5V 4-X2SON

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Documents74LVC1G34GX4Z | Datasheet plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body +6

Integrated Circuits (ICs)

74LVC1G34GX4Z

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Nexperia USA Inc.

IC BUFF NON-INVERT 5.5V 4-X2SON

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Documents74LVC1G34GX4Z | Datasheet plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body +6

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	74LVC1G34GX4Z

Current - Output High, Low	32 mA, 32 mA
Logic Type	Buffer, Non-Inverting
Mounting Type	Surface Mount
Number of Bits per Element	1
Number of Elements	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Output Type	Push-Pull
Package / Case	4-XFDFN
Supplier Device Package	4-X2SON
Supplier Device Package [x]	0.6
Supplier Device Package [y]	0.6
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	1.65 V

74LVC1G34GX4 Series

Single buffer

Part	Number of Bits per Element	Number of Elements	Supplier Device Package [y]	Supplier Device Package [x]	Supplier Device Package	Output Type	Mounting Type	Current - Output High, Low	Voltage - Supply [Min]	Voltage - Supply [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Logic Type
Nexperia USA Inc. 74LVC1G34GX4Z	1	1	0.6	0.6	4-X2SON	Push-Pull	Surface Mount	32 mA 32 mA	1.65 V	5.5 V	125 °C	-40 °C	4-XFDFN	Buffer Non-Inverting

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	8946	$ 0.29

Description

General part information

74LVC1G34GX4 Series

The 74LVC1G34 is a single buffer. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.