Integrated Circuits (ICs)

R7F7016503ABG-C#HC1

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32BIT MCU RH850/F1KM

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Integrated Circuits (ICs)

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32BIT MCU RH850/F1KM

Technical Specifications

Parameters and characteristics for this part

Specification	R7F7016503ABG-C#HC1

Connectivity	UART/USART, Ethernet, CSIO, CANbus, LINbus, I2C, SPI
Core Processor	RH850G3KH
Core Size	32-Bit
EEPROM Size	128 K
Mounting Type	Surface Mount
Number of I/O	174
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	233-FBGA
Peripherals	WDT, DMA, LVD, PWM
Program Memory Size	3 MB
Program Memory Type	FLASH
RAM Size	384 K
Speed	240 MHz
Supplier Device Package	233-FBGA (15x15)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

Part	Program Memory Type	Package / Case	RAM Size	Speed	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Mounting Type	Peripherals	Program Memory Size	Operating Temperature [Max]	Operating Temperature [Min]	Number of I/O	Supplier Device Package	Core Size	Connectivity	EEPROM Size	Oscillator Type	Core Processor
Renesas Electronics Corporation R7F7016503ABG-C#HC1	FLASH	233-FBGA	384 K	240 MHz	5.5 V	3 V	Surface Mount	DMA LVD PWM WDT	3 MB	105 °C	-40 °C	174	233-FBGA (15x15)	32-Bit	CANbus CSIO Ethernet I2C LINbus SPI UART/USART	128 K	Internal	RH850G3KH

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	1000	$ 15.73

General part information

RH850G3KH RH850/F1KM-S4 Microcontroller IC 32-Bit 240MHz 3MB (3M x 8) FLASH 233-FBGA (15x15)

Technical documentation and resources