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40-VFQFN Exposed Pad
Integrated Circuits (ICs)

BD63005AMUV-E2

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Rohm Semiconductor

MOTOR DRIVER, 3-PH BRUSHLESS, VQFN-40

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40-VFQFN Exposed Pad
Integrated Circuits (ICs)

BD63005AMUV-E2

Active
Rohm Semiconductor

MOTOR DRIVER, 3-PH BRUSHLESS, VQFN-40

Technical Specifications

Parameters and characteristics for this part

SpecificationBD63005AMUV-E2
ApplicationsGeneral Purpose
Current - Output2 A
FunctionDriver
InterfaceLogic
Motor Type - AC, DCBrushless DC (BLDC)
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-25 °C
Output ConfigurationPre-Driver - Half Bridge (3)
Package / Case40-VFQFN Exposed Pad
Supplier Device PackageVQFN040V6060
TechnologyPower MOSFET
Voltage - Load [Max]28 V
Voltage - Load [Min]10 V
Voltage - Supply [Max]28 V
Voltage - Supply [Min]10 VDC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.89
10$ 3.49
25$ 3.30
100$ 2.86
250$ 2.71
500$ 2.43
1000$ 2.05
Digi-Reel® 1$ 3.89
10$ 3.49
25$ 3.30
100$ 2.86
250$ 2.71
500$ 2.43
1000$ 2.05
N/A 1979$ 3.67
Tape & Reel (TR) 2000$ 1.81
NewarkEach (Supplied on Cut Tape) 1$ 4.93
10$ 3.44
25$ 2.96
50$ 2.69
100$ 2.42
250$ 2.16
500$ 2.00
1000$ 1.89

Description

General part information

BD63005 Series

BD63005AMUV is a Three-Phase Brushless Motor Driver with a 33V power supply voltage rating and a 2A (3.5A peak) output current rating. It generates a driving signal from the Hall sensor and drives PWM through the input control signal. In addition, the power supply can use 12V or 24V and it has various controls and built-in protection functions, making it useful for variety of purposes. Since the IC adopts small packages, it can be used on small diameter motors.

Documents

Technical documentation and resources

BD63005AMUV-E2 Flammability

Related Document

What Is Thermal Design

Thermal Design

Thermal Resistance

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation

Package Information

Compliance with the ELV directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

VQFN040V6060 Package Information

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

BD63005AMUV Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Factory Information

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Five Steps for Successful Thermal Design of IC

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Technical Data Sheet EN

Datasheet

Product Change Notice EN

Datasheet