Integrated Circuits (ICs)

AS4C32M16MSA-6BIN

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DRAM 512M 166MHZ 32MX16 MOBILE LP SDRAM IT

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Integrated Circuits (ICs)

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DRAM 512M 166MHZ 32MX16 MOBILE LP SDRAM IT

Technical Specifications

Parameters and characteristics for this part

Specification	AS4C32M16MSA-6BIN

Access Time	5.5 ns
Clock Frequency	166 MHz
Memory Format	DRAM
Memory Interface	Parallel
Memory Organization	32M x 16
Memory Size	64 MB
Memory Type	Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	54-VFBGA
Supplier Device Package	54-FBGA
Supplier Device Package [custom]	8x8
Technology	SDRAM - Mobile SDRAM
Voltage - Supply [Max]	1.95 V
Voltage - Supply [Min]	1.7 V

Part	Memory Interface	Memory Organization	Supplier Device Package [custom]	Supplier Device Package	Mounting Type	Memory Type	Memory Size	Access Time	Clock Frequency	Technology	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Voltage - Supply [Max]	Voltage - Supply [Min]	Memory Format
Alliance Memory, Inc. AS4C32M16MSA-6BIN	Parallel	32M x 16	8x8	54-FBGA	Surface Mount	Volatile	64 MB	5.5 ns	166 MHz	SDRAM - Mobile SDRAM	-40 °C	85 °C	54-VFBGA	1.95 V	1.7 V	DRAM

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General part information

DRAM 512M 166MHZ 32MX16 MOBILE LP SDRAM IT

Technical documentation and resources

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