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Discrete Semiconductor Products

UM6J1NTN

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Rohm Semiconductor

MOSFET, DUAL P-CH, -30V, SOT-363

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Product schematic image
Discrete Semiconductor Products

UM6J1NTN

Active
Rohm Semiconductor

MOSFET, DUAL P-CH, -30V, SOT-363

Technical Specifications

Parameters and characteristics for this part

SpecificationUM6J1NTN
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C200 mA
Drain to Source Voltage (Vdss)30 V
FET FeatureLogic Level Gate
Input Capacitance (Ciss) (Max) @ Vds30 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-363, SC-88, 6-TSSOP
Rds On (Max) @ Id, Vgs1.4 Ohm
Supplier Device PackageUMT6
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 8145$ 0.73
NewarkEach (Supplied on Cut Tape) 1$ 0.63
10$ 0.43
25$ 0.39
50$ 0.35
100$ 0.30
300$ 0.27
500$ 0.23
1000$ 0.19

Description

General part information

UM6J1N Series

Complex type MOSFETs(P+P) are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

ESD Data

Characteristics Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Create Symbols for PSpice Models

Models

Package Dimensions

Package Information

Anti-Whisker formation - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What is a Thermal Model? (Transistor)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

UM6J1N Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Taping Information

Package Information

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the RoHS directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Reliability Test Result

Manufacturing Data