Deep-Dive with AI
Search across all available documentation for this part.
Documents10-2513-11 | Datasheet
Deep-Dive with AI
Documents10-2513-11 | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 10-2513-11 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 Áin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Features | Closed Frame |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 10 |
| Number of Positions or Pins (Grid) [x] | 2 |
| Number of Positions or Pins (Grid) [y] | 5 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 0.1 in |
| Pitch - Post | 2.54 mm |
| Termination | Solder |
| Type | DIP |
| Type | 5.08 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 2.50 | |
Description
General part information
10-2513-11
CONN IC DIP SOCKET 10POS GOLD
Documents
Technical documentation and resources