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HMC619-SX
RF and Wireless

HMC619-SX

Obsolete
Analog Devices Inc./Maxim Integrated

IC RF AMP GP 0HZ-10GHZ DIE 1=2PC

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HMC619-SX
RF and Wireless

HMC619-SX

Obsolete
Analog Devices Inc./Maxim Integrated

IC RF AMP GP 0HZ-10GHZ DIE 1=2PC

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationHMC619-SX
Current - Supply300 mA
Frequency [Max]10 GHz
Frequency [Min]0 Hz
Gain12 dBi
Mounting TypeSurface Mount
Noise Figure5 dB
P1dB27.5 dBm
Package / CaseDie
RF TypeGeneral Purpose
Supplier Device PackageDie
Voltage - Supply12 VDC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated

Description

General part information

HMC619 Series

The HMC619 devices are GaAs, monolithic microwave integrated circuit (MMIC), and PHEMT distributed power amplifier die which operate between dc and 10 GHz. These amplifiers provide 11 dB or 12.8 dB of gain, ±37 dBm output IP3, and 27 dBm or 28 dBm of output power at 1 dB gain compression, while requiring 300 mA from a +12 V supply. Gain flatness is excellent at ±0.4 dB or ±0.5 dB from dc to 10GHz, making the HMC619 devices ideal for EW, ECM, radar, and test equipment applications. The HMC619 devices inputs/outputs are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All chip data is taken with the chip connected via two 0.025 mm (1 mil) wire bonds of minimal 0.31 mm (12 mils) length.ApplicationsTelecom infrastructureMicrowave radio and VSATMilitary and spaceTest instrumentationFiber optics

Documents

Technical documentation and resources