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Discrete Semiconductor Products

2SC5585TL

Active
Rohm Semiconductor

NPN, SOT-416, 12V 0.5A, LOW VCE(SAT) TRANSISTOR

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Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

2SC5585TL

Active
Rohm Semiconductor

NPN, SOT-416, 12V 0.5A, LOW VCE(SAT) TRANSISTOR

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2SC5585TL
Current - Collector (Ic) (Max) [Max]500 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition320 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-416, SC-75
Power - Max [Max]150 mW
Supplier Device PackageEMT3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic250 mV
Voltage - Collector Emitter Breakdown (Max) [Max]12 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.43
10$ 0.33
100$ 0.20
500$ 0.18
1000$ 0.13
Digi-Reel® 1$ 0.43
10$ 0.33
100$ 0.20
500$ 0.18
1000$ 0.13
N/A 634$ 0.57
Tape & Reel (TR) 3000$ 0.12
6000$ 0.11
9000$ 0.10
30000$ 0.10
75000$ 0.09

Description

General part information

2SC5585 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

2SC5585 Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

About Export Regulations

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Package Dimensions

Package Information

ESD Data

Characteristics Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Types and Features of Transistors

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Inner Structure

Package Information

DTA114EEFRA

Datasheet