Specification	BC69PASX

Current - Collector (Ic) (Max) [Max]	2 A
Current - Collector Cutoff (Max) [Max]	100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	85
Frequency - Transition	140 MHz
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	3-UDFN Exposed Pad
Power - Max [Max]	420 mW
Supplier Device Package	DFN2020D-3
Transistor Type	PNP
Vce Saturation (Max) @ Ib, Ic	0.6 V
Voltage - Collector Emitter Breakdown (Max) [Max]	20 V

BC69PAS Series

20 V, 2 A PNP medium power transistors

Part	Frequency - Transition	Vce Saturation (Max) @ Ib, Ic	Transistor Type	Current - Collector Cutoff (Max) [Max]	Supplier Device Package	Voltage - Collector Emitter Breakdown (Max) [Max]	Operating Temperature	Package / Case	Power - Max [Max]	Current - Collector (Ic) (Max) [Max]	Mounting Type	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]
Nexperia USA Inc. BC69PASX	140 MHz	0.6 V	PNP	100 nA	DFN2020D-3	20 V	150 °C	3-UDFN Exposed Pad	420 mW	2 A	Surface Mount	85

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	3776	$ 0.08
	N/A	513	$ 0.63
		100000	$ 0.23

Description

General part information

BC69PAS Series

PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

Documents

Technical documentation and resources

BC69PASX | Datasheet

Datasheet

小巧轻便的汽车二极管和晶体管

Brochure

plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

Marcom graphics

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

Package information

BC69PASX

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BC69PASX

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Technical Specifications

BC69PAS Series

Pricing

Description

BC69PAS Series

Documents

BC69PASX | Datasheet

小巧轻便的汽车 二极管和晶体管

plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

Reflow soldering profile

Nexperia package poster

Thermal performance of DFN packages

BC69PAS Nexperia Product Reliability

Small & light automotive diodes and transistors

DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation

Thermal performance of DFN packages

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

BC69PAS Series

小巧轻便的汽车二极管和晶体管