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RH6G040CHTB1
Discrete Semiconductor Products

RH6G040CHTB1

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 40V, 135A, HSMT ROHS COMPLIANT: YES

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RH6G040CHTB1
Discrete Semiconductor Products

RH6G040CHTB1

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 40V, 135A, HSMT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRH6G040CHTB1
Current - Continuous Drain (Id) @ 25°C135 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 6 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]32 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1930 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)2.4 W, 93 W
Rds On (Max) @ Id, Vgs2.5 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3000$ 2.32
NewarkEach (Supplied on Cut Tape) 1$ 1.91
10$ 1.29
25$ 1.20
50$ 1.09
100$ 0.99
250$ 0.86
500$ 0.82
1000$ 0.73

Description

General part information

RH6G040CH Series

RH6G040CH is a power MOSFET with low on-resistance and High power small mold package, suitable for switching, motor drives, and DC/DC converter.

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Compliance of the RoHS directive

Environmental Data

HSMT8(TB1) Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

HSMT8(TB1) Dimension

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What Is Thermal Design

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

RH6G040CH ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

HSMT8(TB1) Taping Information

Package Information

RH6G040CH Data Sheet

Data Sheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

Types and Features of Transistors

Application Note

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article