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SCS302AJTLL
Discrete Semiconductor Products

SCS306AJTLL

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Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 6 A, 19 NC, TO-263AB

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SCS302AJTLL
Discrete Semiconductor Products

SCS306AJTLL

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 6 A, 19 NC, TO-263AB

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS306AJTLL
Capacitance @ Vr, F300 pF
Current - Average Rectified (Io)6 A
Current - Reverse Leakage @ Vr30 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]175 ░C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Reverse Recovery Time (trr)0 ns
Speed500 mA
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.69
10$ 3.10
100$ 2.20
500$ 1.82
Digi-Reel® 1$ 4.69
10$ 3.10
100$ 2.20
500$ 1.82
N/A 2023$ 4.69
Tape & Reel (TR) 1000$ 1.70
2000$ 1.68
NewarkEach 1$ 4.53
10$ 3.09
25$ 2.80
50$ 2.52
100$ 2.24
250$ 2.14
500$ 1.87

Description

General part information

SCS306 Series

Low forward voltage, negligible recovery time/current. Suitable for switch mode power supply, uninterruptible power supply, solar inverter, etc.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Diode Types and Applications

Technical Article

Package Dimensions

Package Information

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

Compliance of the ELV directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

About Export Administration Regulations (EAR)

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering

Package Information

Anti-Whisker formation

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (SiC Power Device)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

How to Use Thermal Models

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Create Symbols for PSpice Models

Models

Moisture Sensitivity Level

Package Information

PCB Layout Thermal Design Guide

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design