
HMC-AUH318
ObsoleteMEDIUM POWER AMPLIFIER CHIP, 71 - 76 GHZ
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HMC-AUH318
ObsoleteMEDIUM POWER AMPLIFIER CHIP, 71 - 76 GHZ
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | HMC-AUH318 |
|---|---|
| Current - Supply | 160 mA |
| Frequency [Max] | 76 GHz |
| Frequency [Min] | 71 GHz |
| Gain | 24 dB |
| Mounting Type | Surface Mount |
| P1dB | 17.5 dBm |
| Package / Case | Die |
| RF Type | General Purpose |
| Supplier Device Package | Die |
| Test Frequency [Max] | 76 GHz |
| Test Frequency [Min] | 71 GHz |
| Voltage - Supply | 4 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
Description
General part information
HMC-AUH318-DIE Series
The HMC-AUH318 is a high dynamic range, three stage GaAs HEMT MMIC Medium Power Amplifier which operates between 71 and 76 GHz. The HMCAUH318 provides 24 dB of gain, and an output power of +17.5 dBm at 1 dB compression from a +4V supply voltage. All bond pads and the die backside are Ti/Au metallized. The HMC-AUH318 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.ApplicationsShort Haul / High Capacity LinksTest & Measurement EquipmentE-Band Communication Systems
Documents
Technical documentation and resources