Specification	HMC869LC5TR

Current - Supply	100 mA
Function	Downconverter
LO Frequency [Max]	19.5 GHz
LO Frequency [Min]	8.5 GHz
Mounting Type	Surface Mount
Noise Figure	2.8 dB
Package / Case	32-TFCQFN Exposed Pad
RF Frequency [Max]	16 GHz
RF Frequency [Min]	12 GHz
Supplier Device Package	32-CSMT (5x5)
Voltage - Supply	5 VDC, 3 V

HMC869 Series

Part	Supplied Contents	For Use With/Related Products	Frequency [Min]	Frequency [Max]	Utilized IC / Part	Contents	Type	Package / Case	Voltage - Supply	RF Frequency [Max]	RF Frequency [Min]	Noise Figure	Mounting Type	Current - Supply	Supplier Device Package	LO Frequency [Min]	LO Frequency [Max]	Function
Analog Devices Inc./Maxim Integrated 111227-HMC869LC5	Board(s)	HMC869LC5	12 GHz	16 GHz	HMC869LC5	Board(s)	Downconverter
Analog Devices Inc./Maxim Integrated HMC869LC5TR								32-TFCQFN Exposed Pad	3 V 5 VDC	16 GHz	12 GHz	2.8 dB	Surface Mount	100 mA	32-CSMT (5x5)	8.5 GHz	19.5 GHz	Downconverter
Analog Devices Inc./Maxim Integrated HMC869LC5								32-TFCQFN Exposed Pad	3 V 5 VDC	16 GHz	12 GHz	2.8 dB	Surface Mount	100 mA	32-CSMT (5x5)	8.5 GHz	19.5 GHz	Downconverter

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	N/A	0	$ 0.00	1m+

Description

General part information

HMC869 Series

The HMC869LC5 is a GaAs MCM I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 14 dB with a noise figure of 2.8 dB and 32 dB of image rejection. The HMC869LC5 utilizes an LNA followed by an image reject mixer which is driven by an LO buffer amplifier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC869LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.ApplicationsPoint-to-Point and Point-to-Multi-Point RadioMilitary Radar, EW & ELINTSatellite Communications