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12-UFBGA, WLCSP
Integrated Circuits (ICs)

FTL11639UCX

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ON Semiconductor

CONFIGURABLE LOAD SWITCH AND RESET TIMER

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12-UFBGA, WLCSP
Integrated Circuits (ICs)

FTL11639UCX

Active
ON Semiconductor

CONFIGURABLE LOAD SWITCH AND RESET TIMER

Technical Specifications

Parameters and characteristics for this part

SpecificationFTL11639UCX
Current - Output (Max) [Max]4.5 A
FeaturesSlew Rate Controlled, Load Discharge
Input TypeNon-Inverting
InterfaceOn/Off
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output ConfigurationHigh Side
Output TypeP-Channel
Package / Case12-UFBGA, WLCSP
Ratio - Input:Output [custom]1:1
Rds On (Typ)21 mOhm
Supplier Device Package12-WLCSP (1.16x1.56)
Switch TypeGeneral Purpose
Voltage - Supply (Vcc/Vdd)False

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.00
Digi-Reel® 1$ 1.00

Description

General part information

FTL11639 Series

The FTL11639 is both a timer for resetting a mobile device and an advanced load management device for applications requiring a highly integrated solution.If the mobile device is off, holding /SR0 LOW (by pressing power-on key) for 38 ms ±20% turns on the PMIC.As a reset timer, it has one input and one fixed delay output. It generates a fixed delay of 11.5 s ±20% by disconnecting the PMIC from the battery power supply. FTL11639 does not accept a new input signal for 400 ms ±20% to give the PMIC enough time to turn off.The reset delay can be customized by connecting an external resistor to the DELAY_ADJ pin.As an advanced load management switch, the FTL11639 disconnects loads powered from the DC power rail (<6 V) with stringent off-state current targets and high load capacitances (up to 200 µF). The FTL11639 consists of a slew-rate controlled low-impedance MOSFET switch (21 mΏ typical at 4.5 V) that has exceptionally low off-state current drain (<0.2 µA typical) to facilitate compliance with standby power requirements. The slew-rate-controlled turn-on characteristic prevents inrush current and the resulting excessive voltage drop on power rails.The low ICCTenables direct interface to lower-voltage chipsets without external translation, while maintaining low power consumption.The device is packaged in advanced, fully "green," 1.31 mm x 1.62 mm, Wafer-Level Chip-Scale Packaging (WLCSP); providing excellent thermal conductivity, small footprint, and low electrical resistance for a wide application range.